|
| Flux Type |
Water-Soluble |
| Product Characteristics |
Provides hours of stable stencil life, tack time and repeatable brick definition. Robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil like and print speed. The activator package is very aggressive and |
| Residual Removal Method |
Use de-ionized water at 49-60°C (120-140°F) or with Bio-Kleen® saponifier |
| Alloy |
Sn96.5 Ag3.0 Cu0.5 |
| Compliant Specifications |
IPC/J-STD-004 |
| Flux Designator |
ORM0 |
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