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| Product Characteristics |
Developed to reduce bottomside micro-solder balling and bridging on glossy laminates and between connector pins. Designed as a spray flux, 979’s activation system provides excellent wetting producing complete and consistent hole-fill. |
| Percent Solids |
4.2 |
| Specific Gravity |
1.012 |
| Compliant Specifications |
Telcordia Issue
1GR-78-CORE &
IPC/J-STD-004B
Flux designator
ORL0 |
| Residue Removal |
Wash with hot de-ionized water at 49-60°C (140-160°F) or use 1% solution of Bio-KleenR |
| Thinner |
De-ionized Water |
| Flux Test Kit |
PS-20 |
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