|
| Flux Type |
No-Clean |
| Product Characteristics |
EM907 is a first generation solder paste engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically as bright as SnPb joints. Prints down to 0201 pad sites. Designed to be reflowable in air as well as nitrogen. |
| Residual Removal Method |
Not normally required. |
| Alloy |
Sn96.5Ag3.0Cu0.5 |
| Compliant Specifications |
Telcordia Issue 1
GR-78-CORE
IPC/J-STD-004B |
| Flux Designator |
ROL0 |
|
|
