|
Characteristics
|
951
|
186
|
2331-ZX
|
HF-1189A
|
|
Flux
Type
|
Low
Solids
No-Clean
|
"RMA"
No-Clean
|
Neutral
pH
Water Soluble
|
VOC-Free
Organic Water Soluble
|
|
Product
Characteristics
|
Very
low solids, resin free, practically no residue after the soldering
process.
|
Designed
for high thermal stability and superior solderability. Military
approved formula for add-on and rework application.
|
Neutral
pH for the 2331 & 2331-ZX wave solder flux user who has
additional add-on and rework applications.
|
VOC-Free,
halide free, citric acid based, water based flux developed
by Hughes for use in military applications
|
|
Compliant
Specifications
|
Bellcore
Issue 3 TR-TSY-000078 ANSI/J-STD-004
|
ANSI/J-STD-004
|
ANSI/J-STD-004
|
ANSI/J-STD-004
|
|
Residue
Removal
Method
|
Designed
not to be cleaned. May be removed with hot de-ionized water
water at 140-160oF or a 1% solution of Kester's
#5768.
|
Residue
is non-corrosive, however, removal is possible with solvent
or a water wash containing a 7% solution of Kester's #5768.
|
Residue
removal is required. Use soft or de-ionized water at temperatures
of 120-150oF.
|
Residue
removal is required. Use soft or de-ionized water at temperatures
of 120-150oF.
|