|
Product Characteristics
|
Excellent for solderability test procedures specified
by military and commercial industries
|
Designed for high thermal stability and superior solderability.
Kester # 186 is available in 18, 25 or 36 percent solids formulations.
|
Kester's
active, non-corrosive rosin type flux. Used on surfaces which are
more difficult to solder.
|
These active formulations are designed for high speed
wave soldering applications. Varied solids content and halide activity
available
|
|
Residue Removed Method
|
Residue is non corrosive,
but may be removed with solvent or with Kester's # 5768 saponifier
at 7-10% solution in de-ionized or soft water at 120-140° F
|
Residue is non-corrosive,
but may be removed with solvent or with Kester's # 5768 saponifier
at 7-10% solution in de-ionized or soft water at 120-140° F
|
Residue is non-corrosive,
but may be removed with solvent or with Kester's #5768 saponifier
at 7-10% solution in de-ionized or soft water at 120-140° F
|
Residue is non-corrosive,
but may be removed with solvent or with Kester's #5768 saponifier
at 7-10% solution in de-ionized or soft water at 120-140° F
|