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Alcohol Based
Characteristics	2331- ZX	2235	2224 - 25	2222
Flux Type	Neutral pH Organic Water Soluble	Organic Water Soluble	Organic Water Soluble	Highly Activated Organic Water Soluble
Percent Solids	33	11	24	17
Specific Gravity	0.899 ± 0.005	0.856 ± 0.005	0.882 ± 0.005	0.950 ± 0.010
Product Characteristics	Original pH neutral organic flux for automated wave and drag soldering processes	Very active flux for surface mount assemblies designed to help reduce skips on bottom side surface mount pads	Highly active organic flux designed for automated wave soldering applications. Higher percent solids than 2235 for greater heat stability	Kester's highest activity, organic acid flux that can be applied by foam or spray methods
Compliant Specifications	ANSI/J-STD-004	ANSI/J-STD-004	ANSI/J-STD-004	ANSI/J-STD-004
Residue Removal Method	Residue removal is required. Use soft or de-ionized water at temperatures of 120 - 150° F	Residue removal is required. Use soft or de-ionized water at temperatures of 120 - 150° F	Residue removal is required. Use soft or de-ionized water at temperatures of 120 - 150 ° F	Residue removal is required. Use soft or de-ionized water at temperatures of 120 - 150° F
Thinner	4662	4662	4662	4664

VOC - Free
Characteristics	2222-VF	HF-1189A
Flux Type	VOC-Free Organic Water soluble	VOC free Organic Water soluble
Percent Solids	17	40
Specific Gravity	1.043 ± 0.010	1.20 ± 0.010
Product Characteristics	VOC-free, water soluble flux for difficult to solder assemblies which can be applied by spray, dip or foam techniques	VOC-free, halide free citric acid based, water based flux developed by Hughes
Compliant Specifications	ANSI/J-STD-004	ANSI/J-STD-004
Residue Removal Method	Residue removal is required. Use soft or de-ionized water at temperatures of 120 - 150° F	Residue removal is required. Use soft or de-ionized water at temperatures of 120 -150° F
Thinner	De-ionized water	De-ionized water