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Product
Characteristics
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Safe
removal of rosin residue is accomplished by saponification
allowing for aqueous washing. Designed for difficult to remove
solder paste residues. It is non reactive with most metals
present on electronic assemblies.
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The
low evaporation rate and rapid solvent action makes this solvent
economical to use for the removal of rosin flux residues.
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Developed
for the removal of residues left by low solids, no-clean fluxes.
It is more effective than isopropanol.
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Application
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This
concentrated formula is intended to be used at a 5-15% concentration
with water.
It
may be heated to 160oF to further facilitate residue
removal. Designed to be used in a batch or in-line cleaning
system. Not recommended for use in manual or ultrasonic cleaning
operations.
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Soldered
assemblies are best cleaned by dipping them into, or spraying
them with this bench top, cold cleaning solvent. Sufficient
solvent should be used to remove the dissolved residue from
the parts being cleaned.
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Designed
for use in automated conveyer finger cleaning equipment in
soldering machines.
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