|
Alcohol Based
|
|
Characteristics
|
951
|
951BN
|
955
|
|
Flux Type
|
Rosin Free Low Solids No-Clean
|
Low Solids No-Clean
|
Low Solids No-Clean
|
|
Percent Solids
|
2.0
|
2.6
|
1.5
|
|
Specific Gravity
|
0.813 ± 0.003
|
0.807 ± 0.005
|
0.805 ± 0.005
|
|
Product Characteristics
|
Very low solids, Rosin-free, foam and spray
application flux. Practically no residue after the soldering
process
|
Halide-free, rosin-free to give excellent soldering
performance on bare copper PCBs
|
Super low solids, rosin free flux foam and spray
application flux. Designed to have excellent cosmetic appearance
and no white residue formation under humid environment tests
|
|
Compliant specifications
|
Bellcore Issue 3
TR-NWT-000078 & ANSI/J-STD-004
|
Bellcore Issue 3
TR-NWT-000078 & ANSI/J-STD-005
|
Bellcore Issue 3
TR-NWT-000078 & ANSI/J-STD-005
|
|
Thinner #
|
110
|
110-A
|
108-S
|
|
Flux Test Kit
|
PS-22
|
PS-20
|
PS-22
|
|
|
|
Alcohol Based
|
|
Characteristics
|
963
|
1850
|
1515
|
|
Flux Type
|
Low Solids No-Clean
|
Low Solids No-Clean
|
Rosin Activated No-Clean
|
|
Percent Solids
|
3.2
|
3.0
|
15.0
|
|
Specific Gravity
|
0.803 ± 0.005
|
0.800 ± 0.005
|
0.836 ± 0.005
|
|
Product Characteristics
|
Halide-free, rosin-free, foam and spray application
flux. Designed for bare copper and multi layer boards when
cleaning is not required. Residues do not become white under
humid environment
|
Resin containing flux excellent for bare copper
and multi-layered boards. Post soldering residues are minimal
and can be probe tested without removal
|
Low halide rosin flux. Excellent for bare copper
and multi-layered boards. When residues are left on the board,
superior reliability and probe testing will result.
|
|
Compliant
Specifications
|
ANSI/J-STD-004
|
ANSI/J-STD-004
|
ANSI/J-STD-004
|
|
Thinner #
|
108-S
|
108-S
|
3030
|
|
Flux Test Kit
|
PS-22
|
PS-20
|
NA
|
|
|
|
Characteristics
|
971*
|
973*
|
|
Flux Type
|
VOC Free No-Clean
|
VOC Free No-Clean
|
|
Percent Solids
|
2.8
|
3.25
|
|
Specific Gravity
|
1.007 ± 0.010
|
1.006 ± 0.010
|
|
Product Characteristics
|
Designed for foam applications. VOC-Free, no-clean
flux that is water based, water soluble, halide free, non-inflammable
and eliminates the need for a flux thinner
|
Designed for spray applications. VOC Free, no
clean flux that can solder OSP (organic solderability preservative)
treated bare copper boards
|
|
Compliant specifications
|
Bellcore Issue 3
TR-NWT-000078 & ANSI/J-STD-004
|
Bellcore Issue 3
TR-NWT-000078 & ANSI/J-STD-004
|
|
Thinner #
|
De-ionized Water
|
De-ionized Water
|
|
Flux Test Kit
|
PS-20
|
PS-20
|
|
|
