Untitled Document

Kester's Tacky Soldering Fluxes (TSF) are used as a tacky agent and flux vehicle for soldering components to a solid solder deposit (SSD) board surface. They can be used in BGA/PGA ball or pin attachment or rework processes. Kester's TSF products can also function as a soldering flux in flip chip applications or for rework applications on all PCB packages. TSF's are commonly processed using pin transfer, dot dispensing, and/or syringe dispensing methods; but they can also be screen or stencil printed.

Characteristics	6502	6522
Flux Type	No-Clean	No-Clean
Product Characteristics	Formulated for chip scale packaging and production. It combines many good properties into a user friendly product.	Formulated for chip scale packaging and production. More active for fast wetting applications.
Compliant Specifications	Bellcore Compliant ANSI/J-STD-004	Bellcore Compliant ANSI/J-STD-004
Residue Removal Methods	Removal of residues is not required*, but can be done with a solvent or Kester's #5768 saponifier in a 10-12% solution with 140-160^oF de-ionized water.	Removal of residues is not required*, but can be done with a solvent or Kester's #5768 saponifier in a 10-12% solution with 140-160^oF de-ionized water.
Atmosphere Required for Reflow	Air or Nitrogen	Air or Nitrogen

* Rework and repair operations should be qualified by user as no-clean applications.TSF residues may need to be removed depending on the application.