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Solder Paste Formulas for Surface Mount and General Electronic Assemblies

All Kester solder paste formulas are manufactured using the highest quality raw materials available. Kester's worldwide research facilities work together to design solder paste formulas which bring the latest technological deve1opment to electronic manufacturers around the globe. Standard operating procedures are used throughout Kester's worldwide manufacturing Facilities in the production of oxide free solder powders and paste fluxes. A high level of quality and consistency is assured through process control techniques. All product reliability and chemical property testing is conducted by Kester's own certified Chemical Analytical Laboratories.

The solder paste formu1as listed represent the current product recommendations at the time of printing. Please contact Kester's Technical Service Department for a specif1c product recommendation for your application.

Water Soluble Solder Paste Formulas

Characteristics	Product Characteristics	Residue removal Method	Expected Tack Life	Atmosphere Required for Reflow	Compliant Specifications
R596	Standard water soluble formula for all reflow applications. It is resistant to high temperature and humidity	Use de-ionized or soft tap water at 130-150^oF	8+ hours	Air or Nitrogen	ANSI/J-STD-004
R596-3	High activity formula for advanced microelectrons applications.	Use de-ionized or soft tap water at 130-150^oF	6+ hours	Air or Nitrogen	ANSI/J-STD-004

No-Clean Solder Paste Formulas

Characteristics	Product Characteristics	Expected Tack Life	Atmosphere Required for Reflow	Compliant Specifications
R244	Full residue, standard no-clean paste for all reflow applications. R244 is an industry standard formula that combines many good properties into a user friendly product	8+ hours	Air or Nitrogen	Bellcore Issue 3 TR-NWT-000078 ANSI/J-STD-005
R244C	Full residue, more active and tackier version of R244. Designed for fast speed printing applications.	8+ hours	Air or Nitrogen	Bellcore Issue 3 TR-NWT-000078 ANSI/J-STD-005
R253	Full residue, fast wetting paste for applications where post soldering residues need to be compatible with In Circuit Testing.	8+ hours	Air or Nitrogen	Bellcore Issue 3 TR-NWT-000078 ANSI/J-STD-005
R253-5	Full residue, more active version of R253. Designed for fast wetting applications and better compatibility with In Circuit Testing.	8+ hours	Air or Nitrogen	Bellcore Issue 3 TR-NWT-000078 ANSI/J-STD-005
R289TM	Full residue, fast wetting paste designed to meet the needs of high reliability	8+ hours	Air or Nitrogen	Bellcore Issue 3 TR-NWT-000078 ANSI/J-STD-005

Rosin Mildly Activated Solder Paste Formulas

Characteristics	Product Characteristics	Expected Tack Life	Compliant Specifications
R229-25	Good activity formula for good solderability. Designed to have thixotopic property that would suit fine pitch type of mounting.	8+ hours	IPC-SP-818
R229	Design with thixotopic characteristic suitable for syringe dispensing, wash screen printing and actual stenciling. High solubility of residue in solvent.	6+ hours	IPC-SP-818