Product Characteristics |
Designed for Lead-Free soldering where fast wetting is required. Provides high solder joints reliability with low flux splatter. |
Developed for higher thermal requirements for alternative Lead-Free alloy with prevention of flux splash. Excellent solderability and fast wetting to a variety of surface finishes. Low smoke and low odor. Suitable for robotic soldering. |
A newly developed Lead-Free cored wire that provides excellent solderability. Workability enhanced by improving wettability. Successfully lowered flux splattering. |
Residue Removal Method |
Not required for most applications. May be removed by solvent such as IPA, acetone, etc |
Not required for most applications but may be removed using Kester's #5240, #5252 or #5252M |
Not required for most applications. May be removed by solvent such as IPA, acetone, etc |