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LEAD-FREE SOLUTIONS

Lead-Free Epoxy and Tacky Soldering Fluxes (TSF) - rework and attachment of Lead-Free BGA, CSP, and OGA required new flux systems able to sustain higher thermal requirements without charring or rendering flux residue removal difficult.

Epoxy Flux

	Epoxy Flux
Formula	SE-CURE 9611
Product Characteristics	SE-CURE 9600 series epoxy fluxes are desihned for flip chip soldering and underfill applications to printed wiring assemblies. Ideal for FC-BGA/-PGA, DCA, COB, FC-CSP DIE attachment Residue polymerize with underfill for highest level of reliability Air or nitrogen reflowable High activity no-clean soldering/underfill process
Typical Application Methods	Slide Fluxer Rotating drum/doctor blade applicator Thin film applicator
Viscosity (Typical)	5.1 kcps at 5rpm (Brookfield at 25^oC TD-spindle)
Tack (grams-force)	>100
Compliant Specification	IPC ANSI/J-STD-004 Flux designator REH1
Residue Removal Method	Removal of residues is not required but can be done with solvent systems (aliphatic ketones)

Tacky Soldering Fluxes

	No-Clean	Water-Soluble
Formula	TSF-6502	TSF6805L
Product Characteristics	Low viscosity. Ideal for sphere and pin attachment (BGA, CSP, PGA), flip chip mounting (FCAP and FCOB) and no-clean rework operations. High activity no-clean soldering for more difficult metallisation. Compatible with air or nitrogen reflow. Residue interact well with many capillary underfill materials.	For high speed dot dispensing, BGA/PGA or rework application. Stencil print processing window. Solid solder deposit (SSD) or precision pad technology (PPT) boards surfaces.
Typical Application Methods	Stencil or Screen Printing Pin Transfer Rotating Drum/Doctor Blade Applicator Thick Film Applicator	Stencil or Screen Printing Pin Transfer Dot Dispensing Syringe Applications
Viscosity (Typical)	110 poise at 10rpm (Malcom at 25^oC)	125 poise at 10rpm (Malcom at 25^oC)
Tack (grams-force)	115	96
Compliant Specification	IPC ANSI/J-STD-004 Flux designator R0L1	IPC ANSI/J-STD-004 Flux designator 0RH0
Residue Removal Method	Removal of residues is not required but can be done with Kester's #5768 Bio-Kleen saponifier in a 10 to 12% solution with 60^oC-71^oC (140^oF-160^oF) de-ionised automated water wash system.	Remove residue by using de-ionised water in automated cleaning equipment with water temperature at 49^oC-65^oC (120^oF-150^oF)