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Flux Type |
No-Clean |
Product Characteristics |
Designed to exceed customers’ expectations for high yield lead-free manufacturing. NXG33 is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically as bright as SnPb joints. Prints down to 01005 pad sites. Desi |
Residual Removal Method |
Not normally required. |
Alloy |
Sn96.5Ag3.0Cu0.5 |
Compliant Specifications |
IPC/J-STD-004B |
Flux Designator |
ROL0 |
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